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A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies'', and ''die''. ==Images== File:Transistor-die-KSY34.jpg|Single NPN bipolar junction transistor die. File:RGB Light-emitting diode.png|Close-up of an RGB light-emitting diode, showing the three individual silicon dice. File:555-type_Oscilator_Integrated_Circuit.jpg|A small-scale integrated circuit die, with bond wires attached. File:Diopsis.jpg|A VLSI integrated-circuit die. File:Pentiumpro moshen.jpg|Two dice bonded onto one chip carrier. File:Cell-Processor.jpg|The "naked" die without chip carrier of a Cell processor. File:Intel Xeon E7440 open die at heat spreader.jpg|Intel Xeon E7440 die, mounted on heat spreader. Die is 22×23 mm (503 mm2), and contains transistors. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Die (integrated circuit)」の詳細全文を読む スポンサード リンク
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